Advantages of Hybrid Circuits & Typical Applications

Hybrid technology has proven to be the solution to the growing demand to increase circuit performance while drastically reducing the space required for such performance and improved reliability due to the testing and screening of an entire circuit rather than only the individual components. Functional density, however, is only the most obvious advantage of our power hybrids

Advantages of Hybrid Circuits

Extensively used in aerospace, space, defense, medical, industrial, commercial, and communications applications.

General

Miniaturization - Saving of Space and Weight

Fewer and Shorter Interconnections

Mixed Technologies

 

Active and Passive Components

 

Discrete and Monolithic Components

Improved Thermal Efficiency

 

Incorporation of Power Components with/without Low Power Components

 

Use of High Conductivity Ceramics and Metal Packages for Low Thermal Resistance

 

Integrated Heat Sinking of Components

Reduced Inductive Coupling

Improved Reliability due to the Testing and Screening of an entire circuit rather than only the individual components

Fully Tested "Turn-Key" Solution


Electrical

Operates from DC to 20 GHz (Screened Au) or DC to 80 GHz (Etched Au)

Minimum geometries improve high frequency performance

Thick film resistors provide excellent thermal tracking

Active resistor trimming compensates for component variations

0.1% Resistor ratios and absolute values possible

High dielectric isolation with increased high frequency response

Hybrid substrate combines electrical and mechanical functions

Variety of voltages, power levels, frequencies, arrays, etc…


Mechanical

Substantial size and weight reductions

Pin-outs and packaging optimized to simplify system integration

Increased thermal dissipation and reduced temperature gradients

Packaged hybrids are almost indestructible

Proprietary packaging precludes reverse engineering of your design

Operational over extreme temperature range

True integration of semiconductor and passive device technologies

Hyb width="20"rids allow minimal inventory, handling and assembly labor


Economy

High reliability minimizes expensive field failures

Automation of substrate fabrication and assembly reduces cost

Compact circuitry reduces system bulk to increase performance

Modest tooling and development expense

Functional trimming allows use of wider tolerance components

Screen printing offers cost effective resistor fabrication

Wide range of available components allows cost effective choices

Flexibility in design facilitates changes and modifications


Purchasing and Production

Fewer part drawings

Fewer components to purchase

Less stock control

Reduced assembly time and cost

Reduced troubleshooting time


Quality and Reliability

Technological maturity allows reliability optimization in design

Ceramic substrates dissipate heat quickly -circuits run cooler

Minimal number of solder joints and interconnections

Automation optimizes error-free production

850 degree C resistor firing insures stability at operating temperature

Vendor qualification and incoming inspection maintains standards Adherence to military documentation
insures trace ability Less Incoming Inspection Fewer Rejects Supplier Guarantees Interconnects as well
as Components Reduced In-Process Inspection Hybrid Circuits have Demonstrated Lower Failure Rate


Hybrid Circuits: Typical Applications for Military & Industrial Use

Typical Systems

Radar

Guidance Systems

Motor Controls

Computers

Fire Control

Robotics


Typical Systems

Linear Voltage Regulators

Current Regulators

Motor Controllers & Drivers

Power Factor Correction Modules

Converters

DC to DC Converters

Fire Control

Inverters

Power Amplifiers

Rectifier Networks (with & without Snubbers)

Supervisory Circuits

Oscillators

Manufacturing From Prototype Thru Production. We Can Meet Your Deadline.