Thermal conductivity second only to diamond among electrically insulating materials, dissipating nearly 300 W/mK at room temperature.

A thermal coefficient of expansion (TCE) intermediate to silicon or gallium arsenide and metals.

Electrical resistivity and dielectric strength equivalent to competitive materials.

Low dielectric constant (6.7) and low loss index (.0012 at 1Mhz) permitting improved circuit performance at high frequencies.

An inherent stabilizing in oxidizing and reducing high dewpoint atmospheres, unlike nitrides, which will decompose to their oxide equivalent.