96% ALUMINA - The most widely used hybrid circuit substrate material
is aluminum oxide. It has excellent dielectric insulating properties
mechanical strength, a relatively high degree of chemical inertness
and good surface texture characteristics and it is easy to fabricate.
BERYILLIA - Beryllia (BeO) is another substrate that has long been in
use for hybrid applications. The high thermal conductivity and the low
electric constant make it attractive for high power and high frequency
applications. However the use of BeO has been limited by two factors,
the relatively high cost compared to alumina and the toxicity of BeO
dust when sawed, ground or machined.
ALLUMINUM NITRIDE - The primary advantages of alliminum nitride (AIN)
are the high thermal conductivity and it's close TCE match with
silicon. AIN can draw heat away from a silicon device better than
alumina beryllia which will substantially reduce mechanical stresses.
| Conductors Resistors Dielectrics
"Manufacturing From Prototype Thru Production. We Can Meet Your Deadline"