What is thick film hybrid technology?
Process / Definition

Thick film hybrid substrates consist of screened resistive, conductive and dielectric inks on ceramic based substrates . These inks, usually based upon glasses and noble metals, are subsequently fired at temperatures ranging from 600degreesC to 850degreesC to form passive circuit components (i.e. resistors, capacitors) and conducting lines.The most common metals used are silver, gold, palladium, platinum and various combinations to create alloys. The conductor patterns can be multi-layer or double-sided (connected by plated through-holes). The screened resistors can be trimmed to any value using computer controlled laser trimming systems, that can achieve tolerances as tight as +/- .1%. Resistors can be ratio-trimmed, and if required, a functional laser trim can be carried out for most custom devices.

To complete the hybrid circuit, other passive and active component devices are typically attached by epoxy, soldering and wire bonding. These Thick Film Hybrid Circuits can incorporate SMD components and die components. These thick film components are auto Picked, Placed and attached by either conductive epoxies or reflow solder technology.

Typical packaging can include a wide variety of custom configurations along with standard SIP (single in-line) and DIP (dual in-line) packages.

Conductors     Resistors    Dielectrics

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