What is thick film hybrid technology?
Process / Definition
Thick film hybrid substrates consist of screened resistive, conductive
and dielectric inks on ceramic based substrates . These inks, usually
based upon glasses and noble metals, are subsequently fired at
temperatures ranging from 600degreesC to 850degreesC to form passive
circuit components (i.e. resistors, capacitors) and conducting
lines.The most common metals used are silver, gold, palladium,
platinum and various combinations to create alloys. The conductor
patterns can be multi-layer or double-sided (connected by plated
through-holes). The screened resistors can be trimmed to any value
using computer controlled laser trimming systems, that can achieve
tolerances as tight as +/- .1%. Resistors can be ratio-trimmed, and if
required, a functional laser trim can be carried out for most custom
To complete the hybrid circuit, other passive and active component
devices are typically attached by epoxy, soldering and wire bonding.
These Thick Film Hybrid Circuits can incorporate SMD components and
die components. These thick film components are auto Picked, Placed
and attached by either conductive epoxies or reflow solder technology.
Typical packaging can include a wide variety of custom configurations
along with standard SIP (single in-line) and DIP (dual in-line)
| Conductors Resistors Dielectrics
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